Process capability
|
Item
|
Capability Description
|
|
Layer count
|
2-12layer
|
|
Finished board thickness
|
15.7-98.4mil [0.4-2.5mm]
|
|
Min. inner thin core thickness
|
4mil [0.10mm]
|
|
Working panel size
|
Max:20”X24” Min: 10”X10”
|
|
Min. Line width /spacing
|
4/3 mil [0.10/0.08mm]
|
|
Layer to layer registration
|
+/-2mil [0.05mm]
|
|
Drill hole size
|
Φ10-Φ256mil [Φ0.25~Φ6.5mm]
|
|
Min. Finished hole size
|
8mil [0.20mm]
|
|
Drilling true position tolerance
|
+/-2mil [0.05mm]
|
|
Drilling hole tolerance
|
+/-3mil(PTH) [0.08mm]
|
|
+/-2mil(NPTH) [0.05mm]
|
|
|
Line to NPTH hole distance
|
Min. 4mil [0.10mm]
|
|
Line to PAD hole distance
|
Min. 3.5mil [0.089mm]
|
|
PTH thickness
|
Min. 1.0mil [0.025mm]
|
|
the even of panel plating
|
≧90%
|
|
Plating Aspect Ratio
|
7:1
|
|
Solder Mask registration
|
+/-2mil [0.05mm]
|
|
Solder Mask solder dam
|
Min. 3mil [0.08mm]
|
|
Min. outline tolerance
|
+/-4mil [0.10mm]
|
|
Min. G/F chamfer angle
|
20°
|
|
Finished board thickness tolerance
|
+/-4mil [0.10mm]
|
|
Impedance tolerance
|
+/-8~15%ohm
|
|
Bow & Twist
|
<0.7%
|
